1. 2. 3. material content data sheet sales product name ipb014n06n issued 29. august 2013 ma# MA000965710 package pg-to263-7-3 weight* 1552.50 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 26.819 1.73 1.73 17274 17274 leadframe non noble metal iron 7439-89-6 0.803 0.05 517 inorganic material phosphorus 7723-14-0 0.241 0.02 155 non noble metal copper 7440-50-8 801.714 51.65 51.72 516404 517076 wire non noble metal aluminium 7429-90-5 12.139 0.78 0.78 7819 7819 encapsulation organic material carbon black 1333-86-4 8.376 0.54 5395 plastics epoxy resin - 92.138 5.93 59349 inorganic material silicondioxide 60676-86-0 457.900 29.49 35.96 294945 359689 leadfinish non noble metal tin 7440-31-5 12.317 0.79 0.79 7934 7934 plating non noble metal nickel 7440-02-0 0.269 0.02 173 inorganic material phosphorus 7723-14-0 0.001 0.00 0.02 0 173 solder noble metal silver 7440-22-4 0.836 0.05 538 non noble metal tin 7440-31-5 0.669 0.04 431 non noble metal lead 7439-92-1 31.925 2.06 2.15 20564 21533 heatspreader inorganic material phosphorus 7723-14-0 0.032 0.00 21 non noble metal iron 7439-89-6 0.106 0.01 69 non noble metal copper 7440-50-8 106.210 6.84 6.85 68412 68502 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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